000			00619nam a2200193Ia 4500
999			_c51809 _d51809
003			OSt
005			20181023043908.0
008			24419b pe ||||| |||| 00| 0 spa d
040			_cCentro de Información y Bibliotecas
082			_a621.382.DERI.00
100			_aDERICKSON , DENNIS
100			_eAutor
245		0	_aDIGITAL COMMUNICATIONS TEST AND MEASUREMENT: HIGH-SPEED PHYSICAL LAYER CHARACTERIZATION - ED 1. / 2007
250			_a1A. ed
260			_aUSA
260			_bPRENTICE HALL
260			_c2007
300			_a935
300			_c24.8
505			_aCHAPTER 1 FUNDAMENTALS OF DIGITAL COMMUNICATIONS SYSTEMS . -- CHAPTER 2 JITTER BASICS . -- CHAPTER 3 SERIAL COMMUNICATION SYSTEMS AND MODULATION CODES . -- CHAPTER 4 BIT ERROR RATIO TESTING . -- CHAPTER 5 BERT SCAN MEASUREMENTS . -- CHAPTER 6 WAVEFORM ANALYSIS-REAL-TIME SCOPES . -- CHAPTER 7 CHARACTERIZING HIGH-SPEED DIGITAL COMMUNICATIONS SIGNALS AND SYSTEMS WITH THE EQUIVALENT-TIME SAMPLING OSCILLOSCOPE . -- CHAPTER 8 HIGH-SPEED WAVEFORM ANALYSIS ALL-OPTICAL SAMPLING . -- CHAPTER 9 CLOCK SYNTHESIS,PHASE LOCKED LOOPS, AND CLOCK RECOVERY . -- CHAPTER 10 JITTER TOLERANCE TESTING . -- CHAPTER 11 SENSITIVITY TESTING IN OPTICAL DIGITAL COMMUNICATIONS . -- CHAPTER 12 STRESS TEST IN HIGH-SPEED SERIAL LINKS . -- CHAPTER 13 MEASUREMENTS ON INTERCONNECTS . -- CHAPTER 14 FRECUENCY DOMAIN MEASUREMENTS . -- CHAPTER 15 JITTER AND SIGNALING TESTING FOR CHIP-TO-CHIP I/O LINK COMPONENTS AND SYSTEMS . -- APPENDIX A PSEUDO-RANDOM BINARY SEQUENCES . -- APPENDIX B PASSIVE ELEMENTS FOR TEST SETUPS . -- APPENDIX C COAXIAL CABLES AND CONNECTORS . -- APPENDIX D SUPPLEMENTAL MATERIALS FOR CHAPTER 3 . -- INDEX
650			_aCOMUNICACIONES DIGITALES - MEDICIÓN
700			_aMULLER, MARCUS
942			_cTM001 _2ddc